JPH062222Y2 - 多重基板回路モジュール - Google Patents
多重基板回路モジュールInfo
- Publication number
- JPH062222Y2 JPH062222Y2 JP1989034071U JP3407189U JPH062222Y2 JP H062222 Y2 JPH062222 Y2 JP H062222Y2 JP 1989034071 U JP1989034071 U JP 1989034071U JP 3407189 U JP3407189 U JP 3407189U JP H062222 Y2 JPH062222 Y2 JP H062222Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- circuit module
- board
- clip
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 description 20
- 239000004020 conductor Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989034071U JPH062222Y2 (ja) | 1989-03-24 | 1989-03-24 | 多重基板回路モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989034071U JPH062222Y2 (ja) | 1989-03-24 | 1989-03-24 | 多重基板回路モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02124667U JPH02124667U (en]) | 1990-10-15 |
JPH062222Y2 true JPH062222Y2 (ja) | 1994-01-19 |
Family
ID=31538226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989034071U Expired - Lifetime JPH062222Y2 (ja) | 1989-03-24 | 1989-03-24 | 多重基板回路モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH062222Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0439668Y2 (en]) * | 1988-02-24 | 1992-09-17 |
-
1989
- 1989-03-24 JP JP1989034071U patent/JPH062222Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02124667U (en]) | 1990-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH10223817A (ja) | 側面型電子部品の電極構造及びその製造方法 | |
JPH062222Y2 (ja) | 多重基板回路モジュール | |
JP3424685B2 (ja) | 電子回路装置とその製造方法 | |
JPS5930555Y2 (ja) | プリント基板 | |
JP4072415B2 (ja) | フレキシブル回路基板 | |
JPS6242548Y2 (en]) | ||
JPS5994487A (ja) | フレキシブル両面配線板の表裏接続方法 | |
JPH0737328Y2 (ja) | フレキシブル印刷配線板 | |
JPH0351988Y2 (en]) | ||
JP2910668B2 (ja) | 電子部品組立体およびその製造方法ならびに電子部品の接続部材 | |
JPS6352795B2 (en]) | ||
JP3248343B2 (ja) | フレキシブルプリント基板のハンダ接続方法 | |
JPH0822853A (ja) | ピンアサイメント変更用プリント基板 | |
JPH02216891A (ja) | 回路基板の接続方法 | |
JP2715957B2 (ja) | 混成集積回路装置 | |
JPH0634437B2 (ja) | 基板接続構造 | |
JPH0517899Y2 (en]) | ||
JPH0249741Y2 (en]) | ||
JPH05167202A (ja) | フレックスリジット基板 | |
JPS59211295A (ja) | 無半田接続プリント配線板 | |
JPS58105587A (ja) | 回路基板 | |
JPH0491494A (ja) | スルーホールプリント配線基板の製造方法 | |
JPS61245596A (ja) | 多層実装構造 | |
JPH0710969U (ja) | プリント基板 | |
JPS61131493A (ja) | 印刷配線板 |